HUAWEI Consumer Business Group’s CEO Richard Yu has reaffirmed that they are not giving up on the mobile phone business, and that the “king will return in 2023”, whatever that means. This has apparently been tied to rumors of HUAWEI working on their own custom chipset process, but instead of just designing it, they will be manufacturing it as well.
HUAWEI’s Kirin chipsets have made significant progress. While they had humble origins, they were rather comparable to their Qualcomm and Samsung counterparts in 2019. After that, the United States imposed sanctions. As things progressed, HUAWEI lost the capacity to build their own processors at TSMC, and they are now forced to rely on MediaTek and Qualcomm chips, which do not support 5G. HUAWEI, on the other hand, may be seeking to get back into the game by next year, with ambitions to launch proprietary chipsets in 2022.
It will be interesting to see how HUAWEI will be doing this, as while HUAWEI clearly has the ability to design amazing chipsets, they still had to rely on TSMC to manufacture the chips for them. The only way HUAWEI can get back into the game is if they manage to bring a Chinese foundry up to speed with the latest cutting edge processes. Or they start up their own foundry with no US-made tools.
HUAWEI has been previously rumored to kick off their own foundry in 2022, although that will definitely be a very challenging step forward. Starting their own foundry will be a pretty good move, as while TSMC and Samsung are currently the big ones when it comes to chip fabrication, they are struggling to meet the demand from the industry. If HUAWEI manages to rapidly ramp up production, they can not only make their own chips, but also manufacture the chips for other fabless chipmakers, reducing the demand on TSMC and Samsung and potentially alleviating the chip shortage that we are facing globally.
If the rumors are to be trusted, we are still a long way from seeing HUAWEI go up against TSMC and Samsung when it comes to semiconductor manufacturing though. Sources have pointed towards HUAWEI gearing up for mass production on the 28nm node next year, with 14nm in the following year. TSMC and Samsung would most probably be announcing their 3nm nodes by late next year.
As it stands, they might be forced to release the HUAWEI Mate 50 with the Kirin 990, a chipset from 2019. There are also rumors that HUAWEI is delaying the HUAWEI Mate 50 to use the Snapdragon 8 Gen 1 chipset, although it will only come with 4G support.
The News Highlights
- In 2022, HUAWEI will begin developing custom chipsets, with release date set for 2023
- Check the latest Rumors updates and news.
For Latest News Follow us on Google News
- Show all
- Trending News
- Popular By week